Composite phase-change thermal conductive material

The composite phase change thermal conductivity material is a "sandwich structure" composite sheet, in which the surface low melting point alloy is processed by metal indium, tin, bismuth, zinc, silver, aluminum and other metals with certain ductility, with a melting point between 38℃ and 118℃. Multilayer composite thermal conductivity sheet as a phase change material, when the actual application of the heat source (CPU / GPU) temperature is greater than its melting point, the low melting point alloy on the surface melts into a liquid, to fully fill the gap between the heat source and the heat sink, and form the heat channel, the heat is quickly transferred out, to achieve the effect of cooling. The middle layer is made of pure indium, which is soft and can deform and improve the heat dissipation effect at low temperature. At high temperature, it can support the pressing force between the electronic device and the radiator, which is not easy to leak. Composite phase change thermal conductivity material is instead of silicone, gel and other CPU / GPU heat dissipation is very ideal materials, can also be applied to IGBT and large LED heat dissipation, power battery heat dissipation, can ensure the interface filling and low thermal resistance.