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Lead-free Mini Wave Soldering Machine

c-120

Description

APPLICATIONS

This inexpensive bench-top removes or installs through-hole components on SMT boards without damage to adjacent devices. It will process ICs, including DIPs, QFPs, PGAs, connectors and odd forms without reliance on slow, labor-intensive manual methods. The Mini Wave is ideal for short-runs requiring precision and repeatability. Simple to use, the operator first sets the soldering temperature desired from 0?to 399癈 ?covering any tin/lead or lead-free thermal requirement. The correct nozzle is then selected from the 3 that are included, with many additional custom nozzles also available. The wave is activated by an on/off switch while Z-motion wave immersion and dwell time is governed by foot switch. Component removal occurs when solder bonds are fluidized, allowing the operator to extract the component from the PCB. A replacement device can then be placed on the PCB. After prefluxing, the nozzle is positioned allowing soldering to take place.

solder equipment, rework station,

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SMT Peripheral Equipment

Address: fuyong baoan shenzhen china,
shenzhen, Guangdong
China, 518103

Tel: 0086-75527332577
Fax:

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