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8 Layer Layer PCB Gold Plated Finish / Gold Finger / BGA , Single Sided PCB

SYF-003

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Description

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Tg 180 8-Layer Layer PCB Gold Plated Finish / Gold Finger / BGA For Computer Application

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PRODUCT’S?DETAILS |
Raw?Material | FR-4?(Tg?180?available) |
Layer?Count | 8-Layer |
Board?Thickness | 1.6mm |
Copper?Thickness | 2.0oz |
Surface?Finish | ENIG(Electroless?Nickel?Immersion?Gold) |
Solder?Mask | Green |
Silkscreen | White |
Min.?Trace?Width/Spacing | 0.075/0.075mm |
Min.?Hole?Size | 0.25mm |
Hole?Wall?Copper?Thickness | ≥20μm |
Measurement | 300×400mm |
Packaging | Inner:?Vacuum-packed?in?soft?plastic?bales?
Outer:?Cardboard?Cartons?with?double?straps |
Application | Communication,automobile,cell,computer,medical |
Advantage | Competitive?Price,Fast?Delivery,OEM&ODM,Free?Samples, |
Special?Requirements | Buried?And?Blind?Via,?Impedance?Control,?Via?Plug,?
BGA?Soldering?And?Gold?Finger?Are?Acceptable |
Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
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PRODUCTION?CAPABILITY?OF?PCB |
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PROCESS?Engineer | ITEMS?Item | ?????????
?PRODUCTION?CAPABILITY?Manufacturing?Capability |
Laminate | Type | FR-1,FR-5,FR-4?High-Tg,ROGERS,ISOLA,ITEQ,
ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON |
Thickness | 0.2～3.2mm |
Production?Type | ????Layer?Count | 2L-16L |
Surface?Treatment | ?HAL,Gold?Plating,Immersion?Gold,OSP,
Immersion?Silver,Immersion?Tin,Lead?Free?HAL |
?Cut?Lamination | Max.?Working?Panel?size | ?1000×1200mm |
?Inner?Layer | ?Internal?Core?Thickness | 0.1～2.0mm |
?Internal?width/spacing | Min:?4/4mil |
?Internal?Copper?Thickness | 1.0~3.0oz |
?Dimension | Board?Thickness?Tolerance | ±10% |
?Interlayer?Alignment | ±3mil |
Drilling | ?Manufacture?Panel?Size | Max:?650×560mm |
?Drilling?Diameter | ≧0.25mm |
?Hole?Diameter?Tolerance | ±0.05mm |
?Hole?Position?Tolerance | ±0.076mm |
?Min.Annular?Ring? | 0.05mm |
PTH+Panel?Plating | ?Hole?Wall?copper?Thickness | ≧20um |
?Uniformity | ≧90% |
?Outer?Layer | ?Track?Width | Min:?0.08mm |
Track?Spacing | Min:?0.08mm |
?Pattern?Plating | ?Finished?Copper?Thickness | 1oz～3oz |
EING/Flash?Gold | ?Nickel?Thickness | 2.5um~5.0um |
?Gold?Thickness | 0.03~0.05um |
Solder?Mask | Thickness | 15～35um |
?Solder?Mask?Bridge | 3mil |
?Legend | ?Line?width/Line?spacing | 6/6mil |
?Gold?Finger | ?Nickel?Thickness | ≧120u〞 |
?Gold?Thickness | 1～50u〞 |
?Hot?Air?Level | ?Tin?Thickness | 100～300u〞 |
?Routing | ?Tolerance?of?Dimension | ±0.1mm |
?Slot?Size | Min:0.4mm |
Cutter?Diameter | 0.8～2.4mm |
?Punching | ?Outline?Tolerance | ±0.1mm |
Slot?Size | Min:0.5mm |
V-CUT | ?V-CUT?Dimension | Min:60mm |
?Angle | 15°30°45° |
?Remain?Thickness?Tolerance | ±0.1mm |
Beveling | Beveling?Dimension | 30～300mm |
Test | Testing?Voltage | 250V |
Max.Dimension | 540×400mm |
Impedance?Control | ?
????Tolerance
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Aspect?Ration | 12:1 |
Laser?Drilling?Size | 4mil(0.1mm) |
Special?Requirements | Buried?And?Blind?Via,?Impedance?Control,?Via?Plug,?
BGA?Soldering?and?Gold?Finger?Are?Acceptable |
OEM&ODM?Service | Yes |
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