Electronic Data Systems

1. Home
2. Products
3. Electronic & Electrical
4. Electronic Data Systems

Share us

HASL 0.6 mm Double Sided PCB Assembly Services For Level Switch

BIC-1601-VER2.1

Send Inquiry

Description

HASL 0.6 mm Double Sided PCB Assembly Services For Level Switch

?

PCB Data Sheets

- - - -
PCB SIZE | 244.2 x 221.2mm=20PCS |
BOARD TYPE | 　 |
Number of Layers | Double sided PCB, 2 Layer PCB |
Surface Mount Components | YES |
Through Hole Components | NO |
LAYER STACKUP | copper ------- 35um(1oz)+plate TOP layer |
FR-4 0.5mm |
copper ------- 35um(1oz)+plate BOT Layer |
TECHNOLOGY | 　 |
Minimum Trace and Space: | 12mil/12mil |
Minmum / Maximum Holes: | 0.5/1.1mm |
Number of Different Holes: | 3 |
Number of Drill Holes: | 265 |
Number of Milled Slots: | 21 |
Number of Internal Cutouts: | 0 |
Impedance Control | no |
BOARD MATERIAL | 　 |
Glass Epoxy: | FR-4, ITEQ IT140 TG>135, er<5.4 |
Final foil external: | 1.5oz |
Final foil internal: | 0oz |
Final height of PCB: | 0.6mm ±0.1 |
PLATING AND COATING | 　 |
Surface Finish | Hot air soldering leveling(HASL),lead free, Sn>=2.54μm |
Solder Mask Apply To: | Top and Bottom, 12micron Minimum |
Solder Mask Color: | Gloss Green, Taiyo PSR-2000GT600D |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing, Fiducial Marks |
MARKING | 　 |
Side of Component Legend | TOP |
Colour of Component Legend | White, S-380W, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH), via tented |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | 　 |
Outline dimension: | 0.0059& quot; |
Board plating: | 0.0029& quot; |
Drill tolerance: | 0.002& quot; |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | Level switch |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
- - - -

?

?

Advantages

a) No MOQ, low cost for small quantity prototypes and samples.

b) PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.

c) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

d) ISO certified PCB manufacturing factory.

?

?

More Application in Electronics

Amplifier
Power Supply
Battery Charger
PLC
Wireless

Amp Power Supply
3G Gateway
Temperature Module
Dc Switching Power Supply
Switch Mode Power Supply Circuit

?

?

RO4350B / RO4003C Laminates Data Sheets

- - - -
Property | Typical Value | Direction | Units | Condition | Test Method |
　 | RO4003C | RO4350B | 　 | 　 | 　 | 　 |
Dielectric Constant, εr Process | 3.38±0.05 | 3.48±0.05 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clampled Stripline |
Dielectric Constant, εr Design | 3.55 | 3.66 | Z | - | 8 to 40 GHz | Differntial Phase Length Method |
Dissipation Factor Tan, δ | 0.0027 0.0021 | 0.0037 0.0031 | Z | - | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
Thermal Coefficient of εr | 40 | 50 | Z | ppm/℃ | minus 50℃ to 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.7 x 101o | 1.2 x 101o | 　 | MΩ·CM | COND A | IPC-TM-650 2.5.17.1 |
Surface Resistivity | 4.2 x 10^9 | 5.7 x 10^9 | 　 | MΩ | COND A | IPC-TM-650 2.5.17.1 |
Electrical Strenghth | 31.8 (780) | 31.2 (780) | Z | KV/mm (V/mil) | 0.51mm (0.020& quot;) | IPC-TM-650 2.5.6.2 |
Tensile Modulus | 19650(2850) 19450(2821) | 16767 (2432) 14153 (2053) | X Y | Mpa(ksi) | RT | ASTM D638 |
Tensile Strength | 139(20.2) 100(14.5) | 203(29.5) 130(18.9) | X Y | Mpa(ksi) | RT | ASTM D638 |
Flexural Strength | 276 (40) | 255 (37) | 　 | Mpa(kpsi) | 　 | IPC-TM-650 2.4.4 |
Dimensional Stability | <0.3 | <0.5 | X,Y | mm/m (mils/inch) | after etch E2/150℃ | IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion | 11 14 46 | 10 12 32 | X Y Z | ppm/℃ | minus 55℃ to 288℃ | IPC-TM-650 2.4.41 |
Tg | >280 | >280 | 　 | ℃ TMA | A | IPC-TM-650 2.4.24 |
Td | 425 | 390 | 　 | ℃ TGA | 　 | ASTM D3850 |
Thermal Conducvitity | 0.71 | 0.69 | 　 | W/m/ok | 80℃ | ASTM C518 |
Moisture Absorption | 0.06 | 0.06 | 　 | % | 48 hrs immersion 0.060& quot; sample Temperature 50℃ | ASTM D570 |
Density | 1.79 | 1.86 | 　 | gm/cm3 | 23℃ | ASTM D792 |
Copper Peel Strength | 1.05 (6.0) | 0.88 (5.0) | 　 | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 |
Flammability | N/A | V-0 | 　 | 　 | 　 | UL 94 |
Lead-Free Process Compatible | Yes | Yes | 　 | 　 | 　 | 　 |
- - - -

?

?

RO4350B and RO4003C Dielectric Constant vs. Frequency

?



?

FAQ

Do you sell flexible PCB(FPC)?
Yes, we offer flexible printed circuits(FPC) with single sided and double sided. Immersion gold and OSP are usually used for this soft boards.

Read More