Batteries & Chargers
Description
8 Layer High Tg PCB FR4 1.6mm Immersion Gold Multilayer Circuit Board
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PCB Data Sheets
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PCB SIZE | 215 x 212mm=1PCS |
BOARD TYPE | |
Number of Layers | Multilayer PCB, 8 layer PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
Prepreg 7628 0.195mm |
copper ------- 35um(1oz) MidLayer 1 |
FR-4 0.2mm |
copper ------- 35um(1oz) MidLayer 2 |
Prepreg 7628 0.195mm |
copper ------- 35um(1oz) MidLayer 3 |
FR-4 0.2mm |
copper ------- 35um(1oz) MidLayer 4 |
Prepreg 7628 0.195mm |
copper ------- 35um(1oz) MidLayer 5 |
FR-4 0.2mm |
copper ------- 35um(1oz) MidLayer 6 |
Prepreg 7628 0.195mm |
copper ------- 18um(0.5oz)+plate BOT Layer |
TECHNOLOGY | |
Minimum Trace and Space: | 4mil/4mil |
Minmum / Maximum Holes: | 0.3/3.2mm |
Number of Different Holes: | 18 |
Number of Drill Holes: | 11584 |
Number of Milled Slots: | 2 |
Number of Internal Cutouts: | 0 |
Impedance Control: | no |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | FR-4 TG170℃, er<5.4.IT-180, ITEQ Supplied |
Final foil external: | 1oz |
Final foil internal: | 1oz |
Final height of PCB: | 1.6mm ±0.16 |
PLATING AND COATING | |
Surface Finish | Immersion gold (32.1% ) 0.05μm over 3μm Nickle |
Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
Solder Mask Color: | Green, PSR-2000 KX700G, Taiyo Supplied. |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing, stamp holes. |
MARKING | |
Side of Component Legend | TOP and Bottom. |
Colour of Component Legend | White, S-380W, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | plated through hole(PTH), minimum size 0.3mm. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059& quot; |
Board plating: | 0.0029& quot; |
Drill tolerance: | 0.002& quot; |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | Codec |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
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Advantages
a) High Tg material. Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application.
b) Immersion gold. Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
c) PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.
d) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
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More Applications In Electronics
Electronics
Gps
Converter
Bluetooth
Bluetooth Headphones
Programmable Logic Controller Plc
Programmable Ac Power Supply
Traco Power Supply
The Power Supply
Power Supply Inverter
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PCB knowledge: PCB production process
1. Contact PCB fabricator
Contact your satisfied vendor such as Bicheng. You’re registered and will be quoted for you. Place your order and follow up the production schedule.
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2. Material cutting
Purpose: According to the requirement from engineering data, cut the large plate which is in compliance with the requirement into small pieces of production board piece to meet customer requirements of the small sheet.
3. Drill
Purpose: According to the requirement from engineering data, drill all the holes.
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4. Copper deposition
Purpose: Copper deposition is a thin copper deposit on the wall of the insulating hole by chemical method
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5. Pattern transfer
Purpose: Pattern transfer is the transfer of image production on the film to the board
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6. Pattern plating
Purpose: Pattern electroplating is a layer of copper or gold over nickel or tin that requires a thickness plated on the exposed copper of the pattern graphic or on the hole wall.
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7. Film stripping
Purpose: The NaOH solution is used to strip the anti-plating film to expose the non-pattern circuit layer.
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8. Etching
Purpose: Etching is to etch off the non-circuit parts of the copper layer by chemical reaction method
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9. Solder Mask
Purpose: Solder mask is transferring the solder mask film graphics to the board to protect the track and prevent the track from the effect of tin welding during assembly.
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10. Silkscreen
Purpose: The silkscreen character is a mark that is easy to recognize.
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11. Edge connector plating (Gold finger)
Purpose: A nickel gold layer with a thickness is plated on the PCB edge of the plug to make it more resistant to wear.
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HASL (a process of coordinate)
HASL is a layer of tin generated on the non-solder mask area to protect pad copper surface from oxidation to ensure good welding performance.
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12. Contour
Purpose: By stamping or milling machine to cut the PCB into customers& acute; required shape.
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13. Electrical test
Purpose: Through the electronic 100% test to find the open circuit, short circuit and other functional defects which are not easy to find by visual inspection.
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14. Final Inspection
Purpose: Through 100% visual inspection to find out the defects in appearance and repair minor defects to avoid problems and defects in the shipment.
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FAQ
How to order PCBs?
1st step, sending your gerber files for quotation.
2st step, placing your order form to our market department and make the payment.
3rd step, Our CADCAM department dealing with your gerber files, sending you EQ if any.
4th step, PCB manufacturing.
5th step, Shipment and send you tracking number.
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BICHENG ENTERPRISE LIMITED
Single Sided PCB,High Frequency PCB,PCB Prototype Service
Address: 3 203 Shidai Jingyuan Fuyong Town,
Shenzhen, Guangdong
China, 518000
Tel: 86-755-27374946
Fax: 86-755-27374847
